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¡¤Form-In-Place Gasketing
Form-In-Place Gakseting technology, so-called FIPG, is using an automated system to dispense conductive silicone elastomer onto metal or plastic substrates as EMI shielding and grounding gaskets. This technology is particularly well suited for cellular phones, PDAs, PC cards, telecom base stations,and many other cast or plastic enclosures .
Utilizing programmable 3-axis CNC dispensing equipment, the compounds is dispensed accurately onto the substrate and creates a secure bond during the curing process. The repeatable computer-controlled dispensing pattern insures consistency between parts and rapid part program changes. In addition, it supports all levels of volume ¡ªfrom prototyping to mass production, via the use of one or multiple dispensing heads.
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¡¤Fabric-Over-Foam Gasketing
Metallized Polyester Fabric over Polyurethane foam core(FoF) gaskets are setting a new standard for shielding control. Nickel plating over a highly conductive copper plated substrates providing excellent electrical characteristics necessary for high attenuation shielding. Bonding the conductive substrate to the core assures self-termination when cut to length, while providing superior flexibility.
With imported equipment and raw material, Mindar China is manufacturing FOF gaskets in most popular profiles domestically, thus to satisfy the customer with shorter leadtime and lower cost.
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¡¤Die-Cutting
To suit the custom specifications, Mindar China achieve die-cutting for the customers, mostly like all kinds of I/O gaskets. The material varies from FoF gaskets, conductive elastomer, oriented wire in silicone, Foil tapes to thermal insulators.
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